Technical capabilities
- Base material type: FR-4 as a standard
- Other materials are ordered for particular
customer requirements
- Material thickness: 0.2mm ÷ 3.2mm
- copper thickness: 18µm ÷ 105µm
- max. board/panel dimensions: 360 mm x 450 mm
- min. hole diameter: 0.30mm
- min. track width: 0.127mm (5 mils)
- min. distance between tracks and pads: 0.127mm (5 mils)
- single- and double-sided SMD assembly
- min. SMD package: 0.5 mm x 1.0 mm (0402)
- max. SMD package: 55mm x 55mm
